Applications

LOCTITE® ECCOBOND EN UV9070 – Acrylate Edgebond – BGA electronic component bonding for reliability enhancement

  • Item Name: LOCTITE® ECCOBOND EN UV9070

  • Manufacturer: Henkel

  • Technologies: Acrylate

  • Color: Bone-white to beige translucent paste

  • Cure Type: Ultraviolet (UV) light

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

LOCTITE ECCOBOND EN UV9070 is a single-component, thixotropic acrylate adhesive presented as a bone-white to beige translucent paste. It cures quickly under UV light, ensuring efficient processing for electronic assemblies. Engineered for BGA edgebonding, the product enhances the reliability of components by providing strong adhesion, shock absorption, and load-bearing capacity while minimizing migration on the substrate.


2. Applications

  • Edgebonding for BGA components in electronics.

  • Adhesion where resistance to migration and mechanical reinforcement are required.

  • Suitable for high-reliability assemblies exposed to mechanical stress.

3. Typical Properties

Property Condition / Substrate Value
Uncured Material
Viscosity 25 °C, @ 20 s⁻¹ 7,400 mPa·s
Thixotropic Index 20/50 rpm 1.54
Specific Gravity 25 °C 1.1 g/cm³
Curing Performance
Fixture Time 6 mW/cm² @ 365 nm ≤10 sec
Light Intensity 100 mW/cm² @ 365 nm 20 sec
Depth of Cure Optimum conditions 0.2 inch
Cured Material
Glass Transition Temperature (Tg) DMA 120 °C
CTE Below Tg 111 ppm/°C
CTE Above Tg 194 ppm/°C
Storage Modulus DMA @ 25 °C 800 N/mm² (116,030 psi)
Water Absorption 24h @ 25 °C 1.8 %
Water Absorption 2h boiling 3.9 %
Extractable Ions Cl⁻, Na⁺, K⁺ <15 ppm each
Lap Shear Strength Polycarbonate to FR4 8 N/mm² (1,160 psi)

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