Item Name: LOCTITE® ECCOBOND EN 1350
Manufacturer: Henkel
Technologies: Epoxy
Color: Black
Cure Type: Heat cure (1 h @ 120 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 183 days @ 25 °C
LOCTITE ECCOBOND EN 1350 is a black, two-component epoxy encapsulant designed for thermal sensor assembly. It requires mixing at a ratio of 100:2.8 (Part A: Part B by weight). This product is non-conductive, cures quickly at low temperatures, and maintains resistance to high temperatures and moisture. It provides excellent protection and reliability in electronic assemblies, especially where water resistance and stable electrical insulation are critical.
Encapsulation of thermal sensors.
Protection of electronic devices against heat and moisture.
Bonding to substrates such as polyethylene, silicon, and copper.
Assemblies requiring both low-temperature cure and high-temperature performance.
| Property | Condition / Substrate | Value |
|---|---|---|
| Mixed / Uncured Material | ||
| Mix Ratio (by weight) | Part A : Part B | 100 : 2.8 |
| Solids Content | 100 % | |
| Shelf Life | 25 °C | 183 days |
| Work Life | 25 °C | 3 days |
| Curing Performance | ||
| Heat Cure | 1 h @ 120 °C | |
| Cured Material – Physical | ||
| Hardness | Shore D | 90 |
| Glass Transition Temperature (Tg) | TMA | 103 °C |
| CTE Below Tg | 27 ppm/°C | |
| CTE Above Tg | 100 ppm/°C | |
| Tensile Modulus | DMA, 25 °C | 7.5 GPa (7,500 N/mm² / 1,087,783 psi) |
| Cured Material – Electrical | ||
| Volume Resistivity | 25 °C | 3.6 × 10¹⁵ Ω·cm |
| Volume Resistivity | 150 °C | 2.0 × 10¹¹ Ω·cm |
| Volume Resistivity | After PCT, 121 °C, 2 atm, 12 h | 1.0 × 10¹³ Ω·cm |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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