Applications

LOCTITE ECCOBOND EN 3810T – Epoxy Encapsulant – CSP and BGA component encapsulation on printed circuit boards

  • Item Name: LOCTITE ECCOBOND EN 3810T

  • Manufacturer: Henkel

  • Technologies: Epoxy

  • Color: Black liquid

  • Cure Type: Heat cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 12 months

1. Product Overview

LOCTITE ECCOBOND EN 3810T is a one-component, black epoxy adhesive formulated for encapsulation and bonding of electronic components. It offers thixotropic properties for controlled dispensing, cures quickly at moderate temperatures, and delivers high glass transition temperature (Tg) for thermal stability. The material is reworkable, suitable for Pb-free applications, and provides reliable performance under temperature, humidity, and bias conditions.


2. Applications

  • Encapsulation for CSP and BGA packages

  • Bonding and protection of electronic components on PCBs

  • Ideal for assemblies requiring high Tg, reworkability, and stable electronic performance under harsh conditions

3. Typical Properties

Property Uncured Cured
Appearance Black liquid Solid adhesive
Viscosity (25 °C, 20 rpm) 7,200 mPa·s
Thixotropic Index 4.8
Specific Gravity 1.2
Pot Life (25 °C) 3 days
Shelf Life (-20 °C) 365 days
Heat Cure 8 min @ 130 °C
Glass Transition Temperature (Tg) 107 °C
CTE Below Tg 53 ppm/°C
CTE Above Tg 169 ppm/°C
Modulus (25 °C) 2,700 N/mm² (391,600 psi)

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