Item Name: LOCTITE® ABLESTIK ABP 2025DSINP
Manufacturer: Henkel
Technologies: Proprietary hybrid chemistry
Color: Red
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 2025DSINP is a red, non-conductive die attach adhesive based on proprietary hybrid chemistry with silica filler. It offers strong adhesion across multiple substrates, high hot/wet die shear strength, and is formulated without intentionally added PFAS. The material is heat curable and optimized for array packaging. It is the PFAS-free version of LOCTITE® ABLESTIK 2025DSI.
Die attach in semiconductor packaging
Array packaging (flex and laminate substrates)
High-reliability electronic assemblies requiring strong adhesion and low ionic contamination
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Red paste | Solid adhesive |
| Technology | Proprietary hybrid chemistry | Crosslinked polymer |
| Viscosity @ 25°C, 5 rpm | 16,000 mPa·s | — |
| Thixotropic index (0.5/5 rpm) | 5.0 | — |
| Density | 1.4 g/cm³ | — |
| Work life @ 25°C | 20–24 h (depending on syringe size) | — |
| Shelf life | 365 days @ -40°C | — |
| Cure schedule | Ramp 30 min to 175°C + 15 min @ 175°C (N₂) | Fully cured network |
| Weight loss on cure | — | 3.0% |
| Glass transition temperature (Tg) | — | -35 °C |
| Coefficient of thermal expansion | — | 50 ppm/°C (below Tg); 148 ppm/°C (above Tg) |
| Storage modulus (DMTA) | — | 252 MPa @25°C; 19 MPa @150°C; 105 MPa @250°C |
| Thermal conductivity | — | 0.4 W/(m·K) |
| Moisture absorption (85°C/85% RH) | — | 0.38 wt% |
| Volume resistivity | — | 6.7 × 10¹⁴ Ω·cm |
| Die shear strength (2×2 mm Si die, Ag/Cu leadframe, 25°C) | — | 8.0 kgf |
| Ionic content (Na⁺, K⁺, Cl⁻) | — | <10 ppm each |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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