Item Name: LOCTITE® ABLESTIK ABP 2100ACNP
Manufacturer: Henkel
Technologies: Proprietary hybrid chemistry
Color: Silver
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 month
LOCTITE® ABLESTIK ABP 2100ACNP is a silver, electrically conductive die attach adhesive formulated with silver-coated copper filler and proprietary hybrid chemistry. It provides low stress, ultra-low moisture absorption, Pb-free compatibility, excellent dispensability, and fast curing capability. The adhesive is designed for Pb-free array packaging, can endure reflow temperatures up to 260 °C, and meets automotive grade reliability standards. It is suitable for die sizes up to 12.7 mm × 12.7 mm and does not contain intentionally added PFAS.
Die attach for semiconductor devices
PBGA (Plastic Ball Grid Array) and BGA substrates
High-throughput and Pb-free array packaging
Automotive and high-reliability electronic assemblies
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Silver paste | Solid adhesive |
| Technology | Proprietary hybrid chemistry | Crosslinked conductive polymer |
| Filler | Silver-coated copper | Retained in cured matrix |
| Viscosity @ 25°C, 5 rpm | 10,000 mPa·s | — |
| Thixotropic index (0.5/5 rpm) | 4.5 | — |
| Density | 3.5 g/cm³ | — |
| Work life @ 25°C | 24 h | — |
| Shelf life | 365 days @ -40°C | — |
| Cure schedule | 30 min ramp to 175°C + 15–30 min @ 175°C (N₂) | Fully cured network |
| Glass transition temperature (Tg) | — | 41 °C |
| Coefficient of thermal expansion | — | 60 ppm/°C (below Tg); 160 ppm/°C (above Tg) |
| Storage modulus (DMTA) | — | 3,056 MPa @25°C; 400 MPa @150°C; 524 MPa @250°C |
| Thermal conductivity | — | 1.5 W/(m·K) |
| Weight loss on cure | — | 1.3% |
| Weight loss @300°C | — | 1.6% |
| Moisture absorption (85°C/85% RH) | — | 0.18 wt% |
| Ionic content (Na⁺, K⁺, Cl⁻) | — | <10 ppm each |
| Bond joint resistance | — | 0.002 Ω/0.5 in² |
| Die shear strength (2×2 mm Si die, 25°C) | — | 10 kgf (Ag/Cu), 8 kgf (BGA) |
| Die shear strength (5×5 mm Si die, 250°C) | — | 10 kgf (BGA) |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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