Item Name: LOCTITE ABLESTIK ABP 2045
Manufacturer: Henkel
Technologies: Epoxy
Color: Red
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2045 is a red, one-part epoxy adhesive filled with alumina, designed for non-conductive die attach in semiconductor and electronic applications. It cures at low temperatures with rapid snap cure capability, minimizing stress and warpage between dissimilar surfaces. With its low moisture absorption, fast curing, and stable shelf life, it is well suited for compact camera module (CCM) bonding and other high-throughput processes.
Non-conductive die attach for semiconductors
Camera module (CCM) assembly
Electronic adhesives for high-volume bonding
Low-stress, low-warpage interconnects in sensitive devices
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Red liquid | Solid adhesive |
| Technology | Epoxy | Crosslinked thermoset |
| Filler | Alumina | Retained in cured matrix |
| Viscosity @25°C, 5 rpm | 15,000 mPa·s | — |
| Thixotropic Index (0.5/5 rpm) | 4.0 | — |
| Pot life @25°C | 3 days | — |
| Shelf life | 365 days @ –40°C | — |
| Cure schedule | 3 min @120°C (snap cure); alt: 3 min @95°C or 30 min @80°C | Fully cured adhesive |
| Glass transition temperature (Tg) | — | 33 °C |
| Coefficient of Thermal Expansion | — | 56 ppm/°C (below Tg); 187 ppm/°C (above Tg) |
| Modulus (DMA) | — | 2,924 N/mm² (25°C) |
| Die shear strength (2×2 mil Si die on PCB, 25°C) | — | 15 kgf |
| Warpage (6×6 mm Si die on PCB) | — | 3 µm |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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