Item Name: LOCTITE ABLESTIK ABP 2043
Manufacturer: Henkel
Technologies: Epoxy
Color: Black
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2043 is a black, one-part epoxy adhesive filled with alumina, developed for high-throughput non-conductive die attach in electronic assemblies. It cures at low temperatures with rapid snap cure capability, offering high elongation, low stress, and excellent thermal conductivity for reliable device performance. The material reduces warpage between dissimilar substrates and ensures strong adhesion, making it well suited for advanced camera module applications.
Non-conductive die attach in semiconductor devices
Camera module assembly
PCB and steel component bonding
Electronic materials requiring thermal dissipation and drop test reliability
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Black | Solid adhesive |
| Technology | Epoxy | Crosslinked thermoset |
| Filler | Alumina | Retained in cured matrix |
| Viscosity @25°C, 5 rpm | 14,000 mPa·s | — |
| Thixotropic Index (0.5/5 rpm) | 4.2 | — |
| Work life @25°C | 3 days | — |
| Shelf life | 365 days @ –40°C | — |
| Cure schedule | 3 min @95°C (snap cure); alt: 30 min @80°C | Fully cured adhesive |
| Weight loss on cure | — | 0.3% |
| Glass transition temperature (Tg) | — | 26 °C |
| Coefficient of Thermal Expansion | — | 50 ppm/°C (below Tg); 195 ppm/°C (above Tg) |
| Modulus (DMA) | — | 1,900 N/mm² (25°C) |
| Thermal conductivity | — | 0.5 W/(m·K) |
| Elongation @ break | — | 70% |
| Ionic content | — | Na⁺ 1 ppm, K⁺ 1 ppm, Cl⁻ 82 ppm |
| Die shear strength (3×3 mm Si die on PCB, 25°C) | — | 12 kgf |
| Warpage | — | 0.5 µm (Si die on PCB), 1 µm (Si die on Ni) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.