• Item Name: LOCTITE ABLESTIK ABP 2042AA
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2042AA is a one-component, non-conductive epoxy adhesive in black paste form. It is formulated for high-throughput semiconductor and camera module assembly. The adhesive provides low stress, fast curing at low temperatures, excellent elongation, thermal conductivity, and minimal warpage, making it highly reliable for drop-test performance and heat dissipation in compact electronic packages.
Semiconductor die attach
Camera module (CCM) assembly
Bonding on substrates such as PCB and steel
High-throughput electronic material packaging
| Property | Value | Condition/Note |
|---|---|---|
| Uncured Material | ||
| Viscosity | 14,000 cP | Brookfield CP51, 25°C, 5 rpm |
| Thixotropic Index | 4.3 | (0.5/5 rpm) |
| Work Life | 3 days | 25°C |
| Shelf Life | 365 days | -40°C |
| Cure Schedule | 3 min @ 95°C (snap) / 30 min @ 80°C (oven) | Recommended |
| Weight Loss on Cure | 0.3 % | – |
| Cured Material | ||
| Glass Transition Temp (Tg) | 31°C | by TMA |
| CTE (below Tg / above Tg) | 55 / 169 ppm/°C | – |
| Thermal Conductivity | 0.5 W/m·K | – |
| DMA Modulus | 3,700 N/mm² (537,000 psi) | 25°C |
| Elongation @ break | 50 % | – |
| Volume Shrinkage | 2.5 % | – |
| Ionic Content | Na⁺: 2 ppm, K⁺: 0.3 ppm, Cl⁻: 150 ppm | – |
| Die Shear Strength | 15 kg-f | Si die on PCB, cured 30 min @ 80°C |
| Warpage | 2–3 µm | Depending on die size |
This material balances thermal conductivity, flexibility, and fast cure, making it an ideal choice for CCM assembly and semiconductor packaging where heat dissipation and mechanical reliability are critical.
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