• Item Name: LOCTITE® ABLESTIK ABP 8068TS
• Manufacturer: Henkel
• Technologies: Silver Pressure-less Sintering Epoxy
• Color: Silver-gray paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8068TS is a silver-gray, one-part die attach paste based on silver pressure-less sintering technology. Formulated with an epoxy binder, it offers excellent workability, high thermal and electrical conductivity, superior sintering performance, and strong reliability for advanced semiconductor packages. The product is designed as a high-lead solder replacement, delivering enhanced thermal performance compared to solder paste. It also provides robust adhesion, low stress, and excellent resin bleed-out (RBO) control across multiple substrates.
Die attach for high-end semiconductor packages (SiP, QFN, LGA)
Power device packaging requiring high thermal/electrical performance
Assembly on substrates including Au, PPF, and Ag
Alternative to high-lead solder in advanced electronic modules
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Silver-gray paste | Solid adhesive |
| Technology | Silver sintering epoxy | Crosslinked structure |
| Filler | Silver | — |
| Viscosity @25°C, 5 rpm | 13,500 mPa·s | — |
| Thixotropic Index (0.5/5 rpm) | 6.9 | — |
| Work Life | 24 h @25°C | — |
| Shelf Life | 365 days @ –40°C | — |
| Cure Schedule | Ramp to 130°C, hold 30–90 min; ramp to 200°C, hold 120 min (N₂ oven) | Fully sintered adhesive |
| Weight Loss on Cure | — | 5.3% (TGA) |
| Bond Line Thickness (BLT) | 15–35 µm (≤3×3 mm die) | — |
| Tg (TMA) | — | 10°C |
| CTE (below/above Tg) | — | 28 / 42 ppm/°C |
| DMA Modulus | — | 32.0 GPa @ –65°C; 24.7 GPa @25°C; 13.5 GPa @150°C; 9.8 GPa @250°C |
| Moisture Absorption | — | 0.06% @85°C/85% RH |
| Thermal Conductivity | — | 150 W/m·K |
| Volume Resistivity | — | 4×10⁻⁶ ohm·cm |
| Die Shear Strength (HTDSS, 260°C) | — | 3.0–4.0 kgf (1×1 mm die); 10.2–11.0 kgf (2×2 mm die) depending on substrate |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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