• Item Name: LOCTITE® ABLESTIK ABP 8068TH
• Manufacturer: Henkel
• Technologies: Silver Pressure-less Sintering Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8068TH is a silver, one-component die attach paste formulated with silver pressure-less sintering technology. It delivers excellent dispensing stability, long open time, high thermal conductivity, and robust reliability. Compared with ABP 8068TB, it offers enhanced sintering performance, improved resin bleed-out (RBO) control, and superior thermal dissipation. Its unique sintering system ensures low stress bonding with excellent workability, making it suitable for advanced semiconductor and LED packaging.
Conductive die attach for semiconductor devices
Electronic adhesives and solder replacement
LED packaging requiring high thermal performance
Suitable for packages such as LGA, QFN, SOP, LED
Substrates: ENEPIG/ENIG, Cu, Ag, PPF leadframes
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Silver paste | Solid adhesive |
| Technology | Silver sintering epoxy | Crosslinked/sintered structure |
| Viscosity @25°C, 5 rpm | 13,500 mPa·s | — |
| Thixotropic Index (0.5/5 rpm) | 5.3 | — |
| Work Life | 24 h @25°C | — |
| Shelf Life | 365 days @ –40°C | — |
| Cure Schedule | Ramp to 150°C (30–90 min), then ramp to 200°C (90–120 min, N₂ oven) | Fully sintered adhesive |
| Weight Loss on Cure | — | 9.4% |
| Tg (TMA) | — | 8.7°C |
| CTE (below/above Tg) | — | 26 / 47 ppm/°C |
| Storage Modulus (DMTA) | — | 16.5 GPa @ –65°C; 13.3 GPa @25°C; 4.9 GPa @150°C; 3.9 GPa @250°C |
| Tan Delta | — | 121.3°C |
| Ionic Content | — | Na⁺ <10 ppm; K⁺ <10 ppm; Cl⁻ <20 ppm |
| Thermal Conductivity | — | 150 W/m·K |
| Volume Resistivity | — | 9.9×10⁻⁶ ohm·cm |
| Moisture Absorption | — | 0.075% @85°C/85% RH |
| Die Shear Strength | — | 3.5–4.9 kgf @RT (1×1 mm die, Au/Ag/PPF); 2.3–2.5 kgf @260°C (1×1 mm die); 25–48 kgf @260°C (3×3 mm and 5×5 mm die, Ag on Ag LF) |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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