• Item Name: LOCTITE ABLESTIK ABP 3600T
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Silver
• Cure Type: Heat cure; Snap cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 3600T is a silver, heat-curable, electrically conductive die attach adhesive based on proprietary hybrid chemistry. It is designed for high-reliability package applications with moderate thermal and electrical requirements. The material provides excellent adhesion to silver-plated leadframes (LF) and PPF substrates, offers low bleed, and supports both oven and snap curing. It improves JEDEC performance in L/F packages, particularly for spot silver and PPF L/Fs, making it ideal for advanced electronic packaging.
Die attach for semiconductor devices
High-reliability electronic packages requiring moderate thermal and electrical conductivity
Suitable for silver-plated LF and PPF substrates
Uncured Material
| Property | Value |
|---|---|
| Viscosity (Brookfield CP51, 25 °C, 5 rpm) | 8,880 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 5.0 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
Cured Material
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion | Below Tg: 60 ppm/°C, Above Tg: 195 ppm/°C |
| Glass Transition Temperature (DMTA) | 240 °C |
| Thermal Conductivity | 2.5 W/(m·K) |
| Tensile Modulus (DMTA) | @25 °C: 7,840 N/mm², @150 °C: 5,090 N/mm², @250 °C: 2,900 N/mm² |
| Extractable Ionic Content @ 100°C | Cl⁻ <10 ppm, Na⁺ <10 ppm, K⁺ <30 ppm |
| Volume Resistivity | 8.1×10⁻⁵ ohm·cm |
| Shear Strength (120×120 mils Si die on Ag/Cu LF, 25°C) | 17 kg-f |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.