• Item Name: LOCTITE ABLESTIK ABP 3533
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 3533 is a silver, heat-curable, electrically conductive die attach adhesive based on epoxy technology. It is formulated for high-reliability package applications and provides excellent electrical conductivity, enabling low RDSon in MOSFET devices. The material features moderate modulus, low stress, good adhesion, and low outgassing, making it suitable for bonding both non-BSM and BSM dies of varying sizes. Its one-component system ensures ease of use and high workability for electronic packaging.
Die attach for semiconductor devices, including MOSFETs
Suitable for non-BSM and BSM dies of small to large sizes
Typical packages: SOIC, SOP, QFP, and QFN
Substrates: Ag, Cu, and PPF leadframes
Uncured Material
| Property | Value |
|---|---|
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 7,000 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 4.0 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
Cured Material
| Property | Value |
|---|---|
| Weight Loss on Cure (TGA @ 175°C) | 2.7% |
| Coefficient of Thermal Expansion | Below Tg: 90 ppm/°C, Above Tg: 213 ppm/°C |
| Glass Transition Temperature (TMA) | 32 °C |
| Dynamic Tensile Modulus (DMA) | -65°C: 5,950 MPa, 25°C: 4,300 MPa, 150–250°C: 130 MPa |
| Extractable Ionic Content @ 100°C | Cl⁻ ≤20 ppm, Na⁺ ≤10 ppm, K⁺ ≤10 ppm |
| Thermal Conductivity | 3.8 W/m·K |
| Volume Resistivity | 1.0×10⁻⁴ ohm·cm |
| Die Shear Strength (2×2 mm die, kg-f) | Ag LF: RT 12.0, 260°C 1.4; Cu LF: RT 8.0, 260°C 1.5; PPF LF: RT 10.0, 260°C 1.3 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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