Item Name: LOCTITE® ABLESTIK ABP 8600NP
Manufacturer: Henkel
Technologies: Acrylate
Color: Silver
Cure Type: Snap cure or heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 8600NP is a silver-filled acrylate die attach adhesive designed for high-reliability electronic packages with medium thermal and electrical requirements. It provides good adhesion to Ag, PPF, and Cu substrates, thermally and electrically conductive performance, and low bleed. This is a non-PFAS version of LOCTITE® ABLESTIK 8600.
Cure Method: Snap cure or heat cure
Typical Package Applications: Small SO and QFN type packages
Die attach for semiconductor devices with medium thermal/electrical requirements
Suitable for small SO and QFN packages
Compatible substrates: Ag, PPF, Cu
Not recommended for high-density matrix leadframes (>500 pads)
Uncured Material
| Property | Value |
|---|---|
| Technology | Acrylate |
| Appearance | Silver |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 7,500 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 5.1 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
Curing Performance
| Cure Method | Conditions |
|---|---|
| Snap cure | Zones: 150°C, 160°C, 180°C, 220°C, 220°C, 220°C, 220°C; Total 60 s, N₂ |
| Oven cure | 30 min ramp to 175°C + hold 15 min, N₂ or Air |
| Weight Loss on Cure | 2.5% |
Cured Material
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg, TMA) | 112 °C |
| Coefficient of Thermal Expansion (CTE, ppm/°C) | Below Tg: 49, Above Tg: 106 |
| Thermal Conductivity (Laser Flash) | >4 W/m·K |
| Storage Modulus (DMTA) | @25°C: 9,956 MPa, @250°C: 2,133 MPa |
| Extractable Ionic Content | Na⁺ <10 ppm, K⁺ <10 ppm, Cl⁻ <10 ppm |
| Volume Resistivity (Oven Cure) | 6.5×10⁻⁵ ohm·cm |
Adhesion Properties (Die Shear Strength, kg-f)
| Die Size / Substrate | @RT | @260°C |
|---|---|---|
| 2×2 mm Ag BSM, PPF LF | 16 | 3.7 |
| 2×2 mm Ag BSM, Rough Cu LF | 8.2 | 3.2 |
| 3×3 mm Si die, Ag LF | 18 | – |
| 3×3 mm Si die, PPF LF | 18 | – |
| 3×3 mm Si die, Rough Cu LF | 12 | – |
| 5×5 mm Ag BSM, PPF LF | – | 11.4 |
| 5×5 mm Ag BSM, Rough Cu LF | – | 12.4 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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