Item Name: LOCTITE® ABLESTIK ABP 2053SNP
Manufacturer: Henkel
Technologies: Proprietary hybrid chemistry
Color: Red paste
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 2053SNP is a non-conductive die attach adhesive formulated with proprietary hybrid chemistry. It comes as a red paste and is a single-component, low-stress material designed without intentionally added PFAS. The adhesive is primarily heat-cured and suitable for flex, laminate, and die-to-die substrates. This product has been widely used in array packaging and ensures reliable bonding performance with minimal ionic contamination.
Non-conductive die attach in semiconductor packaging
Array packaging applications
Flexible and laminate electronic substrates
High-reliability bonding in die-to-die configurations
| Property | Value |
|---|---|
| Uncured Material | |
| Viscosity, Brookfield CP51, 25ºC, mPa·s (cP) | 16,000 |
| Thixotropic index (0.5 rpm / 5 rpm) | 3.0 |
| Shelf life @ -40°C, days | 365 |
| Work life @ 25°C, hours | 24 |
| Flash point | See SDS |
| Curing Performance | |
| Recommended cure | 30 min ramp to 175°C + 15 min @ 175°C |
| Alternate cure | 30 min ramp to 150°C + 60 min @ 150°C |
| Weight loss on cure, TGA in N2, % | 1.8 |
| Cured Material | |
| Coefficient of thermal expansion (ppm/°C) | Below Tg: 124, Above Tg: 227 |
| Glass transition temperature (Tg), °C | -20 |
| Extractable ionic content, ppm | Na⁺ <10, K⁺ <10, Cl⁻ <10 |
| Moisture absorption @ 85°C/85% RH, wt% | 0.7 |
| Weight loss @ 300°C, % | 1.7 |
| Tensile modulus, DMTA | -65°C: 1535 N/mm² (222,600 psi), 25°C: 112 N/mm² (16,200 psi), 150°C: 7 N/mm² (1,000 psi), 250°C: 8 N/mm² (1,200 psi) |
| Die shear strength, kgf | 2×2 mm Si on Ag/Cu LF @25°C: 7.2, 3×3 mm Si on PBGA @25°C: 12.2, @260°C: 2.0 |
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