• Item Name: LOCTITE ABLESTIK ABP 8303A
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8303A is a silver-filled, heat-curable BMI hybrid adhesive designed as a conductive die attach paste. It is supplied as a silver paste and is suitable for component assembly and bonding integrated circuits to metal substrates. The adhesive offers one-component convenience, low outgassing, minimal resin bleed-out, high die shear strength, and low stress. Its formulation supports robust attachment of medium to large dies on Cu, Ag, or PPF substrates while maintaining high reliability.
Conductive die attach in semiconductor packaging
Component assembly for QFP, QFN, and metal leadframe packages
Bonding medium to large dies on Cu, Ag, or PPF substrates
Applications requiring low stress and tight control of resin bleed-out
| Property | Value |
|---|---|
| Uncured Material | |
| Viscosity, Brookfield, 25°C, mPa·s (cP) | 10,500 |
| Thixotropic Index (0.5/5 rpm) | 4.6 |
| Work Life @ 25°C, hours | 24 |
| Shelf Life @ -40°C, days | 365 |
| Flash Point | See SDS |
| Curing Performance | |
| Recommended Cure | 30 min ramp to 175°C + 60 min @ 175°C in N₂ oven |
| Weight Loss on Cure, % | 2.8 |
| Cured Material | |
| Glass Transition Temperature (Tg), °C | 30 |
| Coefficient of Thermal Expansion, ppm/°C | Below Tg: 70, Above Tg: 180 |
| Extractable Ionic Content, ppm | Cl⁻ <10, Na⁺ <10, K⁺ <10 |
| Moisture Absorption, % | 0.3 |
| DMA Modulus | 25°C: 1.8 GPa (261,000 psi), 260°C: 0.14 GPa (20,300 psi) |
| Bulk Thermal Conductivity, W/(m·K) | 1.5 |
| Electrical Properties | Volume Resistivity: 0.06 Ω·cm, Bond Joint Resistance (Au-Au): 0.0012 Ω |
| Die Shear Strength, kgf | Si die on Cu LF: 2×2 mm @25°C: 7, 5×5 mm @260°C: 9; Si die on Ag LF: 2×2 mm @25°C: 8, 5×5 mm @260°C: 11; Si die on PPF LF: 2×2 mm @25°C: 7.5, 5×5 mm @260°C: 9 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.