• Item Name: LOCTITE ABLESTIK ACP 3122
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Golden Brown
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 6 months
LOCTITE ABLESTIK ACP 3122 is an anisotropic epoxy adhesive formulated for high-throughput microelectronics assembly. It is snap curable, conducts electrically only along the z-axis, and requires pressure during cure to form reliable interconnections. The adhesive is suitable for small die and component attachment without risk of electrical shorting. It features low-temperature curing, optimized rheology, and is designed for precision assembly of copper circuitry, gold-plated terminators, and silver ink traces.
Technology: Epoxy
Appearance: Golden brown
Cure: Heat cure
Key Benefits: Snap curable, anisotropic conductivity, low temperature cure, optimized rheology, z-axis conductivity only
Assembly of microelectronic components
Attachment of small dies and components
Copper circuitry, gold-plated terminators, silver ink conductive traces
Applications requiring high-throughput, precise, anisotropic electrical connections
| Property | Still Not Mixed | After Mixed / Cured |
|---|---|---|
| Viscosity @ 15 s⁻¹ | 22,000 mPa·s | – |
| Viscosity @ 30 s⁻¹ | 14,000 mPa·s | – |
| Shear Thinning Index | 6 | – |
| Work Life @ 25°C | 24 h | – |
| Shelf Life @ -20°C | 183 days | – |
| Cure Schedule | – | 5 s @ 150°C under pressure |
| Glass Transition Temp (Tg) | – | 100°C |
| Storage Modulus @ 25°C | – | 2,400 N/mm² (344,200 psi) |
| Storage Modulus @ 50°C | – | 1,950 N/mm² (282,200 psi) |
| Storage Modulus @ 100°C | – | 220 N/mm² (32,000 psi) |
| Die Shear Strength (50×50 mil Si die to Cu/PET) | – | 2.2 kg |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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