• Item Name: LOCTITE ABLESTIK ABP 2033S
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 6 months
LOCTITE ABLESTIK ABP 2033S is a silver-filled epoxy adhesive designed for semiconductor applications, particularly camera module assemblies. It is a one-component, electrically conductive paste that cures at low temperatures, offering stable and low contact resistance as an alternative to solder. The adhesive is ideal for precise application via needle dispense and is compatible with substrates such as LCP, nickel, and copper.
Camera module assembly
Semiconductor material bonding
Conductive adhesive applications on LCP, Ni, and Cu substrates
| Property | Before Mixing | After Mixing / Cured |
|---|---|---|
| Appearance | Silver paste | Silver solid |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 13,600 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 3.4 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 180 days | – |
| Cure Schedule | – | 30 min @ 100°C |
| Glass Transition Temperature (Tg) | – | 129°C |
| Coefficient of Thermal Expansion | – | Below Tg: 45 ppm/°C, Above Tg: 129 ppm/°C |
| Extractable Ionic Content | – | Cl⁻: 2.2 ppm, Na⁺: 0.4 ppm |
| DMA Modulus @ 25°C | – | 7.3 GPa |
| Weight Loss @ 100°C | – | 0.1% |
| Volume Resistivity @ 25°C | – | 2×10⁻³ ohm·cm |
| Die Shear Strength @ 25°C | – | Ag LF: 16.0 kg-f, Cu LF: 17.7 kg-f, Ni LF: 8.8 kg-f |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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