• Item Name: LOCTITE® ABLESTIK ABP 2035SCR
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Red
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2035SCR is a red, non-conductive, one-component die attach adhesive using proprietary hybrid chemistry. It is designed for high-throughput die attach applications such as smart cards, minimizing stress and warpage between dissimilar surfaces. The adhesive is snap curable and compatible with encapsulant materials.
Die attach for smart cards
High-throughput assembly
Compatible with encapsulant materials
| Property | Value |
|---|---|
| Technology | Proprietary Hybrid Chemistry |
| Appearance | Red |
| Cure | Heat cure |
| Filler Type | Silica |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 9,830 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 4 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
| Cure Schedule | 2 min @ 120°C |
| Alternate Cure Schedule | 30 min @ 100°C or 60 min @ 80°C |
| Glass Transition Temperature (Tg) | 118°C |
| Thermal Conductivity | 0.4 W/(m·K) |
| Coefficient of Thermal Expansion | Below Tg: 50 ppm/°C, Above Tg: 135 ppm/°C |
| DMA Modulus | 25°C: 1,500 MPa; 150°C: 80 MPa; 250°C: 70 MPa |
| Extractable Ionic Content | Na⁺ <10 ppm, K⁺ <10 ppm, Cl⁻ <10 ppm |
| Die Shear Strength | 2×2 mm Si die on FR4: 10 kg-f 3×3 mm die: Si on Ni: 20 kg-f, Si on Ag: 21 kg-f, Si on Cu: 19.5 kg-f, Si on BGA: 21.5 kg-f |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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