• Item Name: LOCTITE ABLESTIK ABP 6892 BA
• Manufacturer: Henkel
• Technologies: BMI Acrylate
• Color: Transparent
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 6892 BA is a transparent, BMI acrylate-based non-conductive die attach paste designed for low-stress component assembly. It provides fast, low-temperature heat cure, excellent adhesion to diverse substrates, and robust mechanical properties, including high resistance to delamination and popcorning during multiple Pb-free solder reflows. The material is filler-free and exhibits low moisture absorption, making it suitable for reliable electronic packaging applications.
Component assembly
Non-conductive die attach paste for semiconductor devices
Applications requiring low stress and high mechanical reliability
Packages or devices exposed to Pb-free solder reflow temperatures
| Property | Unmixed | Mixed / Cured |
|---|---|---|
| Appearance | Transparent liquid | – |
| Viscosity (Brookfield, 25°C, mPa·s) | 1,150 | – |
| Density (gm/cc) | 1 | – |
| Work Life @ 25°C | 12 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | 15 min ramp to 80°C, hold 60 min or 15 min ramp to 130°C, hold 30 min |
– |
| Glass Transition Temperature (Tg, °C) | – | -11 |
| Tensile Modulus @ 25°C (N/mm² / psi) | – | 124 / 17,984 |
| Tensile Modulus @ 150°C (N/mm² / psi) | – | 16 / 2,320 |
| Light Transmittance (%) | – | >99.5 |
| Dielectric Constant | – | 2.6 |
| Die Shear Strength (3×3 mm Si die on glass, kg-f/die, 25°C) | – | 13 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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