• Item Name: LOCTITE® ABLESTIK ABP 6395TC
• Manufacturer: Henkel
• Technologies: Proprietary epoxy chemistry
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 6395TC is a silver, epoxy-based conductive die attach paste formulated for high-reliability electronic packaging applications. It provides strong adhesion to both non-BSM and BSM dies, as well as various metal surfaces including Ag, Cu, and PPF. The material offers excellent thermal and electrical conductivity, controlled resin bleeding, good dispense workability, and extended open time. Its one-component formulation ensures ease of use while maintaining high mechanical and thermal performance across a wide range of package types.
Die attach for semiconductor devices
Electronic adhesive for TO, DFN, SOP, QFP, and QFN packages
Applications requiring high thermal conductivity and high reliability
Bonding non-BSM and BSM dies of small to large sizes
Suitable for Ag, Cu, and PPF leadframes
| Property | Unmixed | Mixed / Cured |
|---|---|---|
| Appearance | Silver | – |
| Viscosity (Brookfield CP51, 25°C, mPa·s, 5 rpm) | 11,500 | – |
| Thixotropic Index (0.5/5 rpm) | 6.0 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Recommended Cure Schedule | 30 min ramp to 200°C + 30 min @ 200°C in N₂ or Air | – |
| Alternate Cure Schedule | 30 min ramp to 175°C + 60 min @ 175°C in N₂ or Air | – |
| Weight Loss on Cure (%) | – | 4.9 |
| Glass Transition Temperature (Tg, °C) | – | 55 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Below Tg: 48; Above Tg: 115 |
| Storage Modulus (DMTA, MPa) | – | 25°C: 7,664; 150°C: 1,485; 250°C: 1,210 |
| Thermal Conductivity (W/m·K) | – | 30 |
| Moisture Absorption @ 85°C/85% RH (%) | – | 0.15 |
| Volume Resistivity (ohm·cm) | – | 2.4 × 10⁻⁵ |
| Die Shear Strength (kg/f) | – | 2×2 mm Bare Si die on Ag LF: RT 12.0 / 260°C 2.4 2×2 mm Ag BSM die on Cu LF: RT 9.0 / 260°C 2.6 2×2 mm Ag BSM die on PPF LF: RT 10.2 / 260°C 2.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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