• Item Name: LOCTITE® ABLESTIK ABP 6395T
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 6395T is a silver, epoxy-based electrically conductive die attach adhesive engineered for high-reliability and high thermal conductivity in electronic packaging. It provides strong adhesion to both BSM and non-BSM dies and is compatible with a variety of metal surfaces including Ag, Cu, and PPF leadframes. Its one-component formulation ensures good workability, controlled resin bleeding, and consistent performance across small to large die sizes. The material supports high mechanical and thermal performance across standard electronic package types.
Die attach for semiconductor devices
Electronic adhesive for SOIC, SOP, QFP, and QFN packages
Bonding BSM and non-BSM dies of varying sizes
Applications requiring high thermal and electrical conductivity
Use on Ag, Cu, and PPF leadframes
| Property | Unmixed | Mixed / Cured |
|---|---|---|
| Appearance | Silver | – |
| Viscosity (Brookfield CP51, 25°C, mPa·s, 5 rpm) | 8,500 | – |
| Thixotropic Index (0.5/5 rpm) | 6.2 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Recommended Cure Schedule | 30 min ramp to 200°C + 30 min @ 200°C, N₂ or Air | – |
| Alternate Cure Schedule | 30 min ramp to 175°C + 60 min @ 175°C, N₂ or Air | – |
| Weight Loss on Cure (%) | – | 4.1 |
| Glass Transition Temperature (Tg, °C) | – | 7 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Below Tg: 54; Above Tg: 112 |
| Dynamic Tensile Modulus (N/mm² / psi) | – | 25°C: 8,146 / 1,181,477; 150°C: 1,436 / 208,274; 250°C: 1,144 / 165,923 |
| Thermal Conductivity (W/m·K) | – | 200°C cure: 30; 175°C cure: 20 |
| Volume Resistivity (ohm·cm) | – | 4 × 10⁻⁵ |
| Die Shear Strength (kg-f) | – | 2×2 mm Ag BSM die on Ag LF: RT 10 / 260°C 2.8 on Cu LF: RT 9 / 260°C 2.4 on PPF LF: RT 9.4 / 260°C 2.6 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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