• Item Name: LOCTITE ABLESTIK ABP 2288A
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2288A is a silver, hybrid-chemistry epoxy die attach adhesive engineered for low-stress applications across a wide range of package sizes. It is optimized for leadframe applications, providing reliable mechanical and thermal performance while maintaining low ionic contamination. Its one-component formulation ensures ease of use and compatibility with standard electronic assembly processes.
Die attach for semiconductor devices
Leadframe-based package applications
Bonding small to large dies in standard electronic packages
Applications requiring low stress and moderate thermal conductivity
| Property | Unmixed | Mixed / Cured |
|---|---|---|
| Appearance | Silver | – |
| Viscosity (Brookfield CP51, 25°C, mPa·s, 5 rpm) | 8,500 | – |
| Thixotropic Index (0.5/5 rpm) | 4.4 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Recommended Cure Schedule | 30 min ramp to 175°C + 60 min hold in N₂ | – |
| Glass Transition Temperature (Tg, °C) | – | 13 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Below Tg: 80; Above Tg: 170 |
| Dynamic Tensile Modulus (N/mm² / psi) | – | -65°C: 4,500 / 652,670; 25°C: 1,000 / 145,040; 150°C: 150 / 21,755; 250°C: 100 / 14,500 |
| Thermal Conductivity (W/m·K) | – | 0.6 |
| Extractable Ionic Content (ppm) | – | Cl⁻ <10; Na⁺ <10; K⁺ <10 |
| Die Shear Strength (kg-f) | – | 2×2 mm Si die on Cu LF: 25°C 7 / 260°C 2.5 2×2 mm Si die on Ag LF: 25°C 9 / 260°C 2.8 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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