• Item Name: LOCTITE ABLESTIK ABP 2100AC
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Silver Gray
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 1 year
LOCTITE ABLESTIK ABP 2100AC is a silver-gray, hybrid-chemistry epoxy die attach adhesive. It is designed for low-cost, low-stress applications in Pb-free array packaging such as BGA and PBGA. Its formulation with silver-coated copper filler ensures thermal and electrical performance suitable for high reflow temperatures up to 260°C.
Die attach for Pb-free array packages (BGA, PBGA)
High-temperature Pb-free solder reflow (up to 260°C)
Die sizes up to 12.7 × 12.7 mm
Electronic assembly requiring moderate thermal conductivity and mechanical reliability
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Silver Gray | – |
| Viscosity, Brookfield CP51, 25°C, mPa·s (5 rpm) | 9,000 | – |
| Thixotropic Index (0.5/5 rpm) | 4.5 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 1 year | – |
| Recommended Cure Schedule | 30 min ramp to 175°C + 30 min hold in N₂ | – |
| Glass Transition Temperature (Tg, °C) | – | 15 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Below Tg: 65; Above Tg: 175 |
| Tensile Modulus @ 25°C (N/mm² / psi) | – | 1,800 / 261,070 |
| Thermal Conductivity @ 121°C (W/m·K) | – | 1.5 |
| Moisture Absorption @ 85°C / 85% RH (%) | – | 0.2 |
| Electrical Bond Joint Resistance (ohms/0.5 sq.in.) | – | 0.001 |
| Die Shear Strength (kg-f) | – | 2×2 mm BGA: 25°C 6; 5×5 mm BGA: 265°C 5.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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