• Item Name: LOCTITE ABLESTIK ABP 6892
• Manufacturer: Henkel
• Technologies: BMI/Acrylate
• Color: Clear paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 6892 is a clear, non-conductive, halogen-free BMI/acrylate die attach paste. It is designed for low-stress applications with robust mechanical properties, improving package reliability and delamination resistance.
Non-conductive die attach
Low-stress applications requiring high package reliability
Suitable for Si die on glass or similar substrates
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Clear paste | – |
| Technology | BMI/Acrylate | – |
| Thixotropic Index | 1.75 | – |
| Viscosity, Brookfield 25°C, mPa·s (0.5 rpm) | 4,100 | – |
| Work Life @ 25°C | 24 h | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | 15 min ramp to 80°C, hold 60 min OR 15 min ramp to 130°C, hold 30 min | – |
| Glass Transition Temperature (Tg, TMA, °C) | – | -24.6 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Below Tg: 111.4; Above Tg: 190.6 |
| Moisture Absorption, 85°C/85% RH, % | – | 0.44 |
| Outgassing during cure, % | – | 0.7 |
| Tensile Modulus, DMTA (N/mm² / psi) | – | -65°C: 1,912 / 277,312; 25°C: 176 / 25,526; 100°C: 28 / 4,061; 150°C: 24 / 3,480; 250°C: 34 / 4,931 |
| Die Shear Strength, 3×3 mm Si die on Glass, kg-f/die | – | 25°C: 13; 80°C: 6 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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