• Item Name: LOCTITE ABLESTIK ABP 8035M
• Manufacturer: Henkel
• Technologies: Silicone Hydrosilylation
• Color: Clear to slightly hazy liquid
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8035M is a silicone-based, non-conductive die attach adhesive designed for LED applications. It is a one-component system with excellent worklife stability, low outgassing during cure, high adhesion, and high modulus at elevated temperatures. The material provides good thermal stability, transparency, and reliability for high-brightness LED assemblies.
LED die attach in high-brightness LED assemblies
Semiconductor material adhesion
Applications requiring low outgassing and high adhesion
| Property | Unit | Value |
|---|---|---|
| Thixotropic Index (0.5/5 rpm) | – | 4.0 |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 2,500 |
| Work Life @ 25°C | hours | 24 |
| Shelf Life @ -20°C | days | 365 |
| Cure Schedule | – | 30 min ramp to 175°C, hold 60 min in air |
| Alternate Cure | – | 1 hour @ 175°C |
| Weight Loss on Cure | % | -0.5 |
| Dynamic Tensile Modulus (DMA) @ -65°C | N/mm² (psi) | 620 (89,900) |
| Dynamic Tensile Modulus (DMA) @ 25°C | N/mm² (psi) | 240 (34,800) |
| Dynamic Tensile Modulus (DMA) @ 150°C | N/mm² (psi) | 110 (16,000) |
| Dynamic Tensile Modulus (DMA) @ 250°C | N/mm² (psi) | 100 (14,500) |
| Die Shear Strength 1×1 mm Si die @ 25°C | Kg | Si on Glass: 2.5; Si on Laminate: 1.5; Si on Si-Ag/Cu: 1.7 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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