• Item Name: LOCTITE ABLESTIK ABP 8065T
• Manufacturer: Henkel
• Technologies: BMI Acrylate
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8065T is a BMI acrylate-based, silver-filled conductive die-attach adhesive designed for high-reliability semiconductor packages. It combines high electrical and thermal conductivity with excellent die shear strength, making it suitable as a soft-solder replacement for mini dies in power devices. Its dispensable silver paste formulation also prevents channel voids.
Die attach for mini dies in high-reliability packages
Soft solder alternative for power devices requiring high thermal and electrical performance
High-temperature semiconductor bonding applications
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Silver paste |
| Technology | – | BMI Acrylate |
| Filler Content | % | 82 |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 9,000 |
| Thixotropic Index | – | 6.0 |
| Work Life @ 25°C | hours | 24 |
| Shelf Life @ -40°C | days | 365 |
| Cure Schedule | – | 30 min ramp to 175°C, hold 60 min @ 175°C |
| Alternate Cure Schedule | – | 45 min ramp to 200°C, hold 60 min @ 200°C |
| Snap Cure | – | 3 min @ 200–220°C |
| Coefficient of Thermal Expansion | ppm/°C | Below Tg: 40; Above Tg: 146 |
| Thermal Conductivity | W/m·K | 10 |
| Volume Resistivity | ohm·cm | 3×10⁻⁵ |
| Die Shear Strength 1×1 mm Ag die @ 25°C | Kg | >2.5 |
| Die Shear Strength @ 260°C | Kg | >0.8 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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