• Item Name: LOCTITE ABLESTIK ABP 8142B
• Manufacturer: Henkel
• Technologies: Silicone
• Color: Black paste
• Cure Type: Snap Cure or Oven Cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8142B is a silicone-based, non-conductive die attach adhesive specifically developed for MEMs package applications. Its low modulus and snap or oven cure capability make it ideal for bonding sensitive dies with minimal mechanical stress, while providing reliable thermal and mechanical stability.
Die attach for MEMs packages
Low-stress die bonding in precision microelectronics
Automated or manual dispense in high-accuracy assembly processes
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Black paste |
| Technology | – | Silicone |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 12,254 |
| Thixotropic Index | – | 3.3 |
| Work Life @ 25°C | hours | 24 |
| Shelf Life @ -20°C | days | 365 |
| Cure Schedule | – | 30 min @ 150°C |
| Hardness, Shore A | – | 46 |
| Dynamic Tensile Modulus @ 25°C | N/mm² | 2.77 |
| Die Shear Strength 2×2 mm Si die on PBOC | Kg | 3.33 @ 25°C / 1.5 @ 260°C |
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