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Home » Products » ABLESTIK ABP 8068TA – Semi-sintering conductive adhesive for semiconductor packages with high thermal performance

Applications

LOCTITE ABLESTIK ABP 8068TA - TECHNIQ is trusted distributor of HENKEL LOCTITE ABLESTIK.

ABLESTIK ABP 8068TA – Semi-sintering conductive adhesive for semiconductor packages with high thermal performance

• Item Name: LOCTITE ABLESTIK ABP 8068TA
• Manufacturer: Henkel
• Technologies: Semi-sintering, silver-filled, epoxy-assisted
• Color: Grey liquid
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 8068TA is a grey, semi-sintering die attach adhesive designed for semiconductor packages, offering high thermal and electrical conductivity. Its epoxy-assisted formulation ensures excellent adhesion, low stress, high reliability, and thermal stability, making it suitable as a solder replacement. The material is heat-curable, one-component, dispensable, printable, and provides void-free bondlines with superior toughness. It is particularly effective on Ag, PPF, Au, and Cu substrates, and delivers thermal performance comparable to solder paste, with conventional curing at 200°C for one hour.

2. Applications

Semiconductor die attach
Conductive adhesive
Typical package applications: QFN, LGA, HBLED

3. Typical Properties

Not Mixed / Uncured Material

Property	Value
Thixotropic Index (0.5/5 rpm)	6.0
Viscosity, Brookfield CP51 @ 25°C (5 rpm), mPa·s (cP)	9,000
Work Life @ 25°C	24 hours
Shelf Life @ -40°C	365 days
Open Time	2 hours
Flash Point	See SDS

After Mixed / Cured Material

Property	Value
Dynamic Tensile Modulus, DMA @ -65°C	15,800 N/mm²
Dynamic Tensile Modulus, DMA @ 25°C	11,800 N/mm²
Dynamic Tensile Modulus, DMA @ 150°C	2,100 N/mm²
Dynamic Tensile Modulus, DMA @ 250°C	1,500 N/mm²
Coefficient of Thermal Expansion (TMA)	54 ppm/°C
Thermal Conductivity	110 W/(m-K)
Moisture Absorption	0.26%
Extractable Ionic Content: Cl⁻ / Na⁺ / K⁺	35 / 3 / 3 ppm
Volume Resistivity	9.00×10⁻⁶ ohm·cm
In-package Thermal Resistance (7×7 mm² QFN, 2.5×2.5 mm² Ag BSM)	0.499–0.505 K/W
Die Shear Strength @ 260°C (1×1 mm to 5×5 mm die, Ag/Cu/PPF)	0.9–20.2 Kg
Die Shear Strength @ 260°C after Parr Bomb	0.64–20.8 Kg

TDS:

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Applications