• Item Name: LOCTITE ABLESTIK ABP 2100AC
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Silver Gray
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 1 year
LOCTITE ABLESTIK ABP 2100AC is a silver-gray die attach adhesive formulated with proprietary hybrid chemistry. Designed for Pb-free array packaging, it withstands high reflow temperatures up to 260°C and is suitable for die sizes up to 12.7 × 12.7 mm. The product offers low cost, minimal stress during curing, and ensures reliable attachment for BGA and PBGA applications.
Die attach for BGA and PBGA packages
Pb-free semiconductor array packaging
Suitable for die sizes up to 12.7 × 12.7 mm
High-temperature soldering environments (up to 260°C)
| Property | Uncured Material | Cured Material |
|---|---|---|
| Thixotropic Index (0.5/5 rpm) | 4.5 | – |
| Viscosity, Brookfield CP51, 25°C (mPa·s) | 9,000 @ 5 rpm | – |
| Shelf Life @ -40°C | 1 year | – |
| Work Life @ 25°C | 24 hours | – |
| Cure Schedule | 30 min ramp to 175°C, hold 30 min in N₂ | – |
| Coefficient of Thermal Expansion (ppm/°C) | – | 65 below Tg / 175 above Tg |
| Glass Transition Temperature (°C) | – | 15 |
| Tensile Modulus @ 25°C (N/mm²) | – | 1,800 |
| Thermal Conductivity @ 121°C (W/m·K) | – | 1.5 |
| Moisture Absorption @ 85°C/85% RH | – | 0.2 |
| Bond Joint Resistance (ohms/0.5 sq.in.) | – | 0.001 |
| Die Shear Strength | – | 6 kg-f @ 25°C, 5.5 kg-f @ 265°C |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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