• Item Name: LOCTITE ABLESTIK ABP 8920TC
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: White paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8920TC is a white, thermally conductive die attach paste formulated with BMI hybrid technology and alumina filler. It is engineered for robust mechanical performance, high thermal conductivity, excellent adhesion, and good electrical insulation. The product features small, controlled particle size and is suitable for heat cure applications across a range of substrates including BT, copper, silver, PPF, and Alloy 42.
Die attach for electronic materials and semiconductors
Thermal management critical applications
Adhesion on substrates such as BT, copper, silver, PPF, and Alloy 42
Applications requiring robust mechanical and electrical insulation properties
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity, Brookfield CP51, 25°C (mPa·s) | 16,000 @ 5 rpm | – |
| Thixotropic Index (0.5/5 rpm) | 6 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | 30 min ramp to 175°C, hold 1 hr in air or N₂ | – |
| Coefficient of Thermal Expansion (ppm/°C) | – | 19 below Tg / 54 above Tg |
| Glass Transition Temperature (°C) | – | 49 |
| Thermal Conductivity (W/m·K) | – | 3 |
| Tensile Modulus (N/mm²) | – | 8,580 @ 25°C; 2,340 @ 100°C; 1,520 @ 150°C; 839 @ 250°C |
| Extractable Ionic Content (ppm) | – | Cl⁻ <10, Na⁺ <10, K⁺ <10 |
| Dielectric Strength (kV/mm) | – | 31 |
| Die Shear Strength (kg/die) | – | @25°C: PPF 19.8, Cu 20.8; @260°C: PPF 6.8, Cu 7.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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