• Item Name: LOCTITE ABLESTIK ABP 8910T
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Blue
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8910T is a blue, electrically insulating die attach adhesive based on BMI hybrid technology with alumina filler. It features high thermal reliability (MRT performance), good thermal conductivity, and medium modulus for robust mechanical performance. Designed for medium to large die sizes, it delivers high reliability and consistent adhesion across various substrates. The adhesive is heat-curable with a recommended cure profile of 30-minute ramp to 175°C plus 15 minutes at 175°C.
Die attach for medium to large semiconductor dies
Adhesion on substrates such as Copper, Silver, PPF, and Alloy 42
High-reliability electronic assemblies requiring thermal management
Applications requiring controlled bondline thickness and minimal warpage
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity, Brookfield CP51 @ 25°C (mPa·s) | 13,000 @ 5 rpm | – |
| Thixotropic Index (0.5/5 rpm) | ≥4.5 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Recommended Cure | 30 min ramp to 175°C + 15 min @ 175°C | – |
| Coefficient of Thermal Expansion (ppm/°C) | – | 28 below Tg / 96 above Tg |
| Glass Transition Temperature (°C) | – | 30 |
| Thermal Conductivity (W/m·K) | – | 1.3 |
| Extractable Ionic Content (ppm) | – | Cl⁻ ≤20, Na⁺ ≤20, K⁺ ≤20 |
| Tensile Modulus (N/mm²) | – | 8,870 @ 25°C; 2,030 @ 150°C; 1,096 @ 200°C; 1,007 @ 250°C; 10,270 @ -65°C |
| Die Shear Strength (kg-f/die) | – | 3×3 mm Si Die @ 270°C: 4.4–15.4 depending on substrate; 7.5×7.5 mm Si Die Post Mold Bake: 2.1–16.7 depending on substrate; PMB + 5 min @ 270°C and PMB + Moisture vary by substrate |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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