• Item Name: LOCTITE ABLESTIK ABP 8420
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 6 months
LOCTITE ABLESTIK ABP 8420 is a black, non-conductive epoxy adhesive designed for die attach applications, particularly for cap and lid attachment in wirebond packages. It features fast cure capabilities, excellent resin bleed-out (RBO) performance, and good adhesion to plastics (PA) and glass substrates. The black pigmentation helps block stray light, making it suitable for optoelectronic applications.
Cap and diffuser attachment in wirebond packages
Die attach on most plastics and glass
Fast-cure applications using directed heat, hot plate, or conventional ovens
Applications requiring bondline thickness >1 mil over active die faces to avoid die scarring
| Property | Uncured Material | Cured Material |
|---|---|---|
| Appearance | Black | – |
| Technology | Epoxy | – |
| Cure Type | Heat cure | – |
| Viscosity, Brookfield CP51 @ 25°C (mPa·s) | 13,500 @ 5 rpm | – |
| Thixotropic Index (0.5/5 rpm) | 5.8 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -20°C | 180 days | – |
| Cure Schedule | 30 min ramp to 150°C, hold 15 min; alternates: 30 min @100°C, 120 min @80°C, or 60 min @120°C | – |
| Glass Transition Temperature (°C) | – | 75 |
| Coefficient of Thermal Expansion (ppm/°C) | – | 54 below Tg / 154 above Tg |
| Thermal Conductivity (W/m·K) | – | 0.3 |
| Extractable Ionic Content (ppm) | – | Cl⁻ <120, Na⁺ <5, K⁺ <5 |
| Water Extract Conductivity (µmhos/cm) | – | 147 |
| Weight Loss on Cure (%) | – | 0.5 |
| DMA Modulus (N/mm²) | – | 2,850 @ 25°C; 1,919 @ 100°C; 90 @ 150°C; 84 @ 250°C |
| Die Shear Strength (kg-f) | – | 1×1 mm Si die on glass: 6; 2×2 mm Si die on GBA: 15.5, PA: 12, Cu LF: 13; 3×3 mm Glass die on PC: 12 |
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