Item Name: TEROSON® RB 3208 PA-25
Manufacturer: Henkel
Technologies: Rubber
Color: Black
Cure Type: Heat curing (≥170–175 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 6 months
TEROSON® RB 3208 PA-25 is a one-component, heat-curing antiflutter adhesive based on rubber technology. It is solvent-free, exhibits excellent sag resistance, and is resistant to wash-off from aqueous cleaning and pretreatment agents. The adhesive bonds strongly to oily steel sheets, aluminum, and zinc-coated surfaces. After curing, it forms a foamy, flexible structure that is temperature-stable and compatible with E-coat paints, ensuring reliable corrosion protection. It can also be painted after curing.
This adhesive is primarily used in the automotive body shop as an antiflutter material. It shows strong adhesion to oily surfaces, prevents read-through effects due to its low hardness, and provides elasticity across a wide temperature range. It is especially recommended in cases requiring wash-off resistance without pre-gelling or pre-curing.
| Condition | Property | Value |
|---|---|---|
| Uncured | Colour | Black |
| Density | ~1.5 g/cm³ | |
| Consistency | Pasty | |
| Viscosity (DIN 54458) | 180 Pa·s | |
| Test Equipment (P/P) | 25 mm | |
| Frequency | 10 Hz | |
| Deformation | 10 % | |
| Test Temperature | 45 °C | |
| Cured (25 min @ 175 °C) | E-Modulus (ISO 527-3) | ~3.5 MPa |
| Poisson’s Ratio | ~0.36 | |
| Expansion Rate | ~30 % | |
| Shear Strength (DIN EN 1465) | ~0.4 MPa | |
| Bonding Area | 25 × 20 mm | |
| Layer Thickness | 4 mm | |
| Substrate | HDG/EGS, 0.75 mm | |
| Temperature Resistance | Short exposure (1 h) | 200 °C |
| In-service range | -40 to +80 °C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: 41 Street 2, Van Phuc Zone, Hiep Binh Phuoc, Thu Duc City, Ho Chi Minh City, 70000, Vietnam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.