Item Name: TEROSON® RB 3245
Manufacturer: Henkel
Technologies: Rubber
Color: Yellow
Cure Type: Heat curing (≥155 °C)
Package Size: Contact Techniq VN for details.
Shelf Life: 3 months
TEROSON® RB 3245 is a solvent-free, heat-curing, expandable spot-weldable mastic adhesive based on rubber. It chemically cross-links at temperatures above 155 °C, providing a flexible bond with high wash-off resistance without requiring pregelling or precure. The product adheres well to oily steel sheets, shows reliable corrosion resistance, and is designed for easy application with high-pressure pumps. Once cured, it maintains elasticity across a wide temperature range and withstands short-term heat exposure.
TEROSON® RB 3245 is developed as an antiflutter sealant for filling gaps between steel plates and reinforcing structural rigidity against vibrations. In automotive manufacturing, it is commonly used between skin panels and stiffeners of hoods, doors, and bonnets. Additionally, it serves as a spot-weld sealer, especially in cases where ovens or induction precuring are not available but strong wash-off resistance and long-term elasticity are required.
| Condition | Property | Value |
|---|---|---|
| Uncured | Colour | Yellow |
| Consistency | Paste | |
| Specific Gravity | 1.4 ± 0.1 | |
| Solids Content | >95 % | |
| Viscosity (Brookfield, 20 °C, Spindle 7, 2 rpm) | 20,000 – 35,000 mPa·s | |
| Sag Resistance | Good | |
| Cured | Expansion Rate | ~50 % |
| Corrosion Resistance | Good | |
| In-service Temperature Range | -40 to +80 °C | |
| Short-term Temperature Resistance (1 h) | 200 °C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: 41 Street 2, Van Phuc Zone, Hiep Binh Phuoc, Thu Duc City, Ho Chi Minh City, 70000, Vietnam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.