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LOCTITE® HHD8008™ – Methacrylate Structural Adhesive – Bonding Small Devices, Electronics & Mobile Applications

Item Name: LOCTITE® HHD8008™
Manufacturer: Henkel
Technologies: Acrylic (Methacrylate)
Color: Resin Yellow, Hardener Blue, Mixture Green
Cure Type: Room temperature cure (two-component, 10:1 mix ratio)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® HHD8008™ is a two-component methacrylate adhesive formulated for structural bonding of mobile phones, tablets, and other small devices. It cures at room temperature, mixing Part A (yellow resin) and Part B (blue hardener) into a green adhesive. The system is halogen-free, REACH-compliant, and engineered to provide fast fixture times even at low temperatures. It offers excellent adhesion and damp-heat resistance on magnesium-aluminum alloys, anodized aluminum, and PC/ABS blends, ensuring durable bonding in compact electronic assemblies.


2. Applications

  • Structural bonding in mobile phones and tablets

  • Small electronic device assembly

  • Joining of magnesium-aluminum alloys, anodized aluminum, stainless steel, and engineering plastics

  • Situations requiring rapid fixture and resistance to damp heat environments

3. Typical Properties

Property Still Not Mixed (Uncured) After Mixed After Cured (72 h @ 22 °C)
Appearance Part A: Yellow
Part B: Blue
Green Solid polymer
Mix ratio (vol.) 10:1 (A:B)
Specific gravity A: 0.98
B: 1.2
1.0
Viscosity (25 °C) A: 57,350 mPa·s
B: 16,160 mPa·s
Working time Al: 240 s
Steel: 240 s
HDPE: 210 s
Fixture time 180–300 s (substrate dependent)
Peak exotherm 135 °C @ 7 min (10 g)
Tg 54 °C
Thermal expansion 110 ×10⁻⁶ K⁻¹ (below Tg)
Hardness Shore D 70
Shrinkage Linear 5%, Vol. 15%
Tensile strength 18 N/mm² (2,570 psi)
Tensile modulus 840 N/mm² (122,000 psi)
Lap shear strength Al 12–13, Steel 12–13, PC/ABS 6.2 N/mm²
Impact strength 4 J (RT), 3 J (@ -40 °C)
Peel strength (T-peel) Steel 1.7 N/mm, Al 2.1 N/mm
Block shear Glass 7.6, PVC 4.1, Acrylic 3.7, Phenolic 6, Mg 11 N/mm²

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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