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LOCTITE® HHD 3628BK – Polyurethane hot melt adhesive for structural and electronic bonding applications

Item Name: LOCTITE® HHD 3628BK
Manufacturer: Henkel
Technologies: Polyurethane Hot Melt
Color: Black
Cure Type: Moisture and Solidification
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® HHD 3628BK is a black polyurethane reactive hotmelt adhesive designed for structural and electronic bonding applications. It is odorless, 100% solids, and cures by moisture absorption and solidification. The adhesive exhibits high initial strength immediately after solidification, ensuring quick handling capability. It further provides excellent reworkability, strong impact resistance, and chemical resistance, making it suitable for demanding assembly processes. The product is optimized with an open time >4 minutes, ideal for both manual and automated assembly lines.


2. Applications

  • Structural adhesive for assemblies requiring chemical and mechanical durability.

  • Electronic device structural bonding where impact resistance and reworkability are valued.

  • Compatible with substrates such as PC/GF and ink-coated glass.

  • Dispensing options: cartridge gun or syringe-type hotmelt equipment.

3. Typical Properties

Property Value / Description Condition / Notes
Uncured Material
Solids Content 100%
Density 1.1 g/cm³ 25°C
Viscosity 9,000 mPa·s 110°C, Brookfield Thermosel, Spindle #27, 20 rpm
Odor Odorless
Open Time >4 min 25°C, 1 mm bead
Preheating Schedule 20–30 min 100°C
Application Temp 100–130°C
Cure Mechanism Moisture + solidification Handling strength instantly; full cure 1–5 days
Cured Material
Young’s Modulus 60 N/mm²
Elongation at Break 865%
Tensile Strength 16.2 N/mm² 25°C
Cross Tensile Strength >8.0 N/mm² PC/GF to ink glass

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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