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LOCTITE HHD 3894 S – Hot Melt Adhesive – Device Assembly and Structural Bonding of Plastics, Metals

• Item Name: LOCTITE HHD 3894 S
• Manufacturer: Henkel
• Technologies: Polyurethane Hot Melt
• Color: White solid
• Cure Type: Moisture
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® HHD 3894 S is a one-part polyurethane hot melt adhesive supplied as a white solid. It cures by moisture and is characterized by high strength, excellent heat resistance, and good flexibility. Unlike conventional hot melts, it can be applied at relatively low temperatures, making it safer and more efficient for sensitive assemblies. The adhesive is 100% solids, requires no mixing, and is designed for structural bonding where durability under heat and stress is critical.


2. Applications

  • Structural bonding of plastics, metals, and ink-coated surfaces.

  • Device assembly requiring high reliability and heat resistance.

  • Situations demanding flexibility alongside mechanical strength.

3. Typical Properties

Property Still Not Mixed (Uncured) After Mixed After Cured
Appearance White solid
Technology Polyurethane Hot Melt
Cure Method Moisture
Components One part – no mixing
Solids Content 100%
Viscosity @ 180 °C (Spindle 27) 3,500 mPa·s
Flash Point Refer to SDS
Application Temperature 150–180 °C
Softening Point 140 °C
Storage Temperature 5–25 °C (optimal)

The adhesive combines thermal stability, mechanical robustness, and flexible bonding, offering a balance between strength and adaptability. Its performance is tailored to advanced electronic assembly needs, with consistent results across varied substrates.

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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