• Item Name: LOCTITE® HHD 3617BK
• Manufacturer: Henkel
• Technologies: Polyurethane Hot Melt
• Color: Black Solid
• Cure Type: Moisture cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE® HHD 3617BK is a one-component, reactive polyurethane hotmelt adhesive that cures by moisture. It offers excellent flowability to fill small gaps and holes, a low modulus for flexibility, and good reworkability. The product provides high handling strength immediately after application and achieves full strength within 1–7 days. It is suitable for both automatic and manual assembly processes, making it versatile for electronic device manufacturing.
Sealant
Small hole filler in smartphone midframes
Electronic device assembly
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Black Solid | – |
| Solids Content, % | 100 | – |
| Components | One-component | – |
| Viscosity, Brookfield Thermosel, 110°C, mPa·s | 850 | – |
| Density @25°C, g/cm³ | 1.1 | – |
| Skin-over Time @ 0.1 g, min | 20 | – |
| Application Temperature, °C | 90–120 | – |
| Hardness, Shore A | – | 63 |
| Modulus, N/mm² | – | 9.5 |
| Lap Shear Strength, PC to Cu, N/mm² | – | 1.8 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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