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Thermal Management

KAPPA 2000 – Dual-station low pressure molding for PCB and electronics encapsulation with external melt tanks

  • Item Numbers: KAPPA 2000 (dual-station, horizontal injection, external 7L melt tanks, pneumatic clamping)

  • Manufacturer: LPMS USA

  • Application: Low pressure molding for PCB and electronics encapsulation, waterproofing, strain relief, vibration and chemical protection

  • Dispensing Control: Two external 7L melt tanks, 4 thermal control zones, 5.7” touchscreen PLC interface

  • Size & Weight: 1300 × 950 × 1679 mm, 1190 lbs, max mold size 290 × 270 × 150 mm

  • Power & Certification: 200–240 VAC, 1 Phase, 50/60 Hz, 50A, air input 30–100 PSI, safety: light curtains, E-stop, safety doors

  • More information & technologies: Contact to Techniq VN for details. (Email: info@techniq.vn & Tel: +84 88 990 19 29)

1. Product Overview
The KAPPA 2000 is a precision-engineered low pressure molding machine designed for encapsulating sensitive electronics. Featuring a horizontal-injection, dual-station system with two external high-volume melt tanks, it ensures stable performance and rapid throughput. With advanced features such as a 5.7-inch multilingual touchscreen, integrated ejection system, and four-post die set, the KAPPA 2000 supports the molding of large parts with accuracy and consistency. Its five-zone thermal control guarantees precise melt management, while comprehensive operator safety systems – including light curtains, dual-palm actuation, and interlocked doors – enhance both protection and reliability.

2. Applications
The KAPPA 2000 is widely utilized for encapsulating printed circuit boards, connectors, sensors, switches, and batteries. It delivers superior waterproofing, strain relief, and protection against chemicals, shock, and vibration. By replacing traditional potting and conformal coating, it enables reduced cycle times, lower costs, and enhanced throughput. The system is particularly suited for high-demand industries such as automotive electronics, industrial automation, consumer electronics, and medical devices, where durability, lightweight solutions, and sustainable processes are paramount.

3. Typical Properties – Specifications

Parameter Specification
Machine Dimensions 1300 × 950 × 1679 mm · 51.18 × 37.4 × 66.10 in · 1190 lbs
Electricity 200–240 VAC · 1 Phase · 50/60 Hz · 50 A
Air Input 30–100 psi
Air Required > 90 psi
Clamping Method Pneumatic
Clamping Force 1.2 Tons
Clamping Stroke 125 mm
Maximum Mold Size 290 × 270 × 150 mm
Platen Size 290 × 270 mm
Nozzle Type LPMS-G10
Melt Tank Quantity / Volume Two external · 7 L each
Temperature Control Zones 4
Safety Features Two-hand actuation · E-stop button · Light curtains · Side safety doors

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