Bergquist Gap Filler TGF 2100LVO is engineered for electronic control modules, ADAS sensors, on-board chargers (OBC), DC-DC converters, and inverters

Bergquist Gap Filler TGF 2100LVO is engineered for electronic control modules, ADAS sensors, on-board chargers (OBC), DC-DC converters, and inverters

How can next-generation thermal gap fillers transform automotive electronics towards smarter, more sustainable mobility?

Market Trends: The rapid evolution of electric vehicles, ADAS, and advanced power electronics is driving demand for materials that ensure superior heat dissipation, reliability under thermal cycling, and compliance with increasingly stringent REACH and VOC regulations. Manufacturers require thermal interface materials that combine robust processing with long-term electro-mechanical stability to meet the physics-driven challenges of high-density electronic packaging.

Applications: Bergquist Gap Filler TGF 2100LVO is engineered for electronic control modules, ADAS sensors, on-board chargers (OBC), DC-DC converters, and inverters, where managing Joule heating, electrostatic discharge, and dielectric insulation is critical. Its advanced formulation ensures optimal thermal transfer across irregular topographies in electronic assemblies, making it indispensable for automotive powertrain and safety electronics.

Highlights: This two-component silicone-based material provides nominal thermal conductivity of 2.2 W/m∙K, excellent wet-out characteristics, and robust flowability for high-throughput dispensing systems. With an extended working time of over 120 minutes, it enhances line flexibility, minimizes production waste, and ensures consistent interfacial contact, even under the mechanical stresses of vibration, shock, and repeated thermal cycling.

Product Advantage: Unlike conventional thermal gap fillers, Bergquist TGF 2100LVO is formulated with ultra-low volatile siloxane content and is free from D4-D5-D6 siloxanes, ensuring low outgassing, enhanced sustainability, and full REACH compliance. Its room-temperature cure profile (24 hours, heat-accelerated if required) delivers greater process efficiency, while its stable rheology ensures precision in automated dispensing. This makes it a cutting-edge solution that integrates chemistry, physics, electrostatics, and advanced coating technology to achieve reliable, eco-conscious performance in next-generation automotive electronics.

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BERGQUIST® GAP FILLER TGF 2900LVO – Thermal Gap Filler – Automotive, Industrial and Consumer Electronics Assembly Applications

BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.

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