How does Bergquist Gap Pad TGP EMI4000 redefine reliability in thermal management and EMI shielding for next-generation automotive electronics?
✨ Market Trends: The automotive sector is accelerating toward advanced driver assistance systems (ADAS) and V2X/telematics integration, demanding materials that deliver thermal conductivity, electromagnetic shielding, and long-term stability. With OEMs seeking silicone-free solutions to avoid oil migration risks, multifunctional gap pads are now critical enablers of electronic reliability.
✨ Applications: Bergquist Gap Pad TGP EMI4000 is specifically designed for radar systems, telematics control units, and V2X communication modules, where both heat dissipation and EMI attenuation are essential for functionality and safety. Its silicone-free formulation ensures stable performance in highly sensitive electronic environments.
✨ Highlights: Offering thermal conductivity of 4 W/mK and EMI protection up to 77 GHz, this material delivers exceptional multifunctionality in a single solution. The pad’s low-modulus, highly conformable structure minimizes assembly-induced mechanical stress while enhancing surface wet-out, ensuring superior thermal transfer compared to harder interface materials. Its silicone-free design prevents oil migration that can compromise component performance over time.
✨ Product Advantage: Bergquist Gap Pad TGP EMI4000 is a REACH-compliant, silicone-free innovation that eliminates hazardous D3–D6 siloxanes and supports sustainability targets by reducing the number of separate material solutions required. Combining thermal management, EMI shielding, and long-term stability, it sets a new standard for multifunctional performance in automotive electronics.
