How can next-generation phase change adhesives ensure ultra-low thermal resistance and high-reliability heat dissipation for advanced microelectronic systems
✨ Market Trends: The exponential rise of high-performance computing, data centers, and lidless multi-chip architectures intensifies the demand for low-stress, ultra-thin thermal interface materials with superior electrostatic and thermal stability.
✨ Applications: Bergquist Hi Flow THF 5000UT supports high-power networking processors, industrial controllers, and automotive electronics where precision thermal conductivity and mechanical reliability safeguard delicate semiconductor die.
✨ Highlights: With phase change activation at 45°C, the film achieves thermal conductivity up to 8.5 W/mK, delivers 0.04°C-cm²/W impedance at 35 psi, and eliminates pre-burn steps for streamlined assembly.
✨ Product Advantage: This clean, film-based TIM reduces mechanical stress, enhances assembly efficiency, and offers unmatched reliability across 150°C operating conditions for next-gen electronic and electrostatic-sensitive applications.
