How do advanced die attach adhesives and underfill systems redefine reliability in automotive and high-performance semiconductor packaging?
✨ Market Trends: With the acceleration of automotive electrification, AI, and high-performance computing, semiconductor packaging requires thermal stability, low-CTE stress control, and electrical integrity to ensure mission-critical reliability.
✨ Applications: Henkel’s semiconductor materials address power ICs, microcontrollers, flip chips, and sensors, where electrostatic resilience, low dielectric loss, and mechanical durability are vital.
✨ Highlights: Loctite Ablestik 6395T and Loctite Ablestik 8068TI deliver automotive Grade 0 reliability, pressure-less sintering capability, and compatibility with multiple leadframe metallizations. Conductive die attach films Loctite Ablestik CDF 200P and CDF 600P offer precise bondline uniformity, excellent fillet formation, and superior electrical/thermal pathways for MCU packages such as QFPs and TSSOPs. For advanced computing, Loctite Eccobond UF 9000AG underfill ensures rapid capillary flow, high filler density, and robust chip interconnect protection, complemented by lid and stiffener attach solutions for warpage control and electromagnetic shielding.
✨ Product Advantage: This portfolio combines optimized rheology, controlled thermal expansion, and tailored electro-mechanical performance, enabling miniaturization, system-level efficiency, and unmatched reliability in semiconductor assemblies across automotive, industrial, and HPC domains.
