How can high thermal die attach adhesives redefine power IC performance in automotive, industrial, and next-generation electronics?
✨ Market Trends: With the rapid electrification of vehicles, deployment of 5G infrastructure, and advances in power electronics, the industry demands adhesives that combine high thermal conductivity, low electrical resistance, and automotive-grade reliability.
✨ Applications: LOCTITE® ABLESTIK ABP 6395T is formulated for die attach in power ICs, enabling efficient thermal management and electrical conductivity in electric vehicles, industrial automation, and high-frequency telecommunication systems.
✨ Highlights: Delivering 30 W/m·K thermal conductivity without sintering, this advanced formulation enhances heat dissipation, minimizes RDS(on), and supports die sizes up to 3.0 × 3.0 mm under stringent thermal cycling and MSL 1 reliability standards.
✨ Product Advantage: The adhesive ensures design flexibility with compatibility across multiple die finish/lead frame combinations, offers long work-life, eliminates resin bleed-out, and supports sustainable manufacturing with <5% VOC content.
