DOWSIL™ TC-2022 is a one-part, thermally conductive silicone adhesive that provides high tensile strength and excellent thermal conductivity. It is heat-curable at moderate temperatures, making it suitable for bonding applications in electronic assemblies.
DOWSIL™ TC-2022 is ideal for applications requiring thermal management and reliable adhesion, including:
The following table presents the key properties of DOWSIL™ TC-2022 before and after curing.
| Property | Unit | Value |
|---|---|---|
| Type | – | One-part |
| Color | – | Gray |
| Viscosity | cP / Pa·s | 190,000 / 190 |
| Thixotropy | – | 3.7 |
| Property | Unit | Value |
|---|---|---|
| Cure Time (@100°C) | Minutes | 15 |
| Thermal Conductivity | W/m-K | 1.7 |
| Thermal Conductivity | btu/hr-ft-°F | 0.98 |
| Durometer Hardness | Shore A | 90 |
| Lap Shear Strength (Aluminum) | psi / MPa / N/cm² | 600 / 4.1 / 410 |
| Coefficient of Thermal Expansion (CTE) | ppm/°C | 125 |
| Specific Gravity | – | 2.7 |
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