1. Product Overview
LOCTITE ABLESTIK QMI536NB is a low-bleed, non-conductive, PTFE-filled paste designed for stacked die applications requiring low stress and strong mechanical properties. It offers fast curing, high resistance to delamination and popcorning, and enhanced reliability across various surfaces, including solder resist, flexible tape, bare silicon, and die passivations.
2. Applications
3. Typical Properties
| Property | Value |
|---|---|
| Uncured Material | |
| Appearance | White |
| Specific Gravity @ 25°C | 1.37 |
| Pot Life @ 25°C | 12 hours |
| Shelf Life @ -40°C | 365 days |
| Viscosity @ 25°C | 10,000 cps |
| Thixotropic Index | 5 |
| Curing Performance | |
| Recommended Cure | 30 minutes @ 150°C |
| Cured Material | |
| Coefficient of Thermal Expansion (ppm/°C) | α1: 80, α2: 150 |
| Glass Transition Temperature (Tg) | -30°C |
| Extractable Ionic Content (ppm) | Cl⁻ <20, Na⁺ <20, K⁺ <20, F⁻ <20 |
| DMA Modulus @ 25°C | 0.3 GPa |
| Die Shear Strength (1 mil BLT, 300×300 mil die) | >100 kg (on ceramic) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.