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3M™ Charge-Collection Solar Tape 3011(L) – Copper foil tape – solar panels, lamination, solderable electrical connections

  • Item Name: 3M™ Charge-Collection Solar Tape 3011(L)

  • Manufacturer: 3M

  • Technologies: Electrically conductive acrylic adhesive with tin-plated copper foil backing

  • Color: Contact to Techniq VN for details

  • Cure Type: Pressure sensitive (self-adhesive, no curing required)

  • Package Size: 2 mm x 1200 m, level winding roll

  • Shelf Life: Contact to Techniq VN for details

1. Product Overview
3M™ Charge-Collection Solar Tape 3011(L) is a tin-plated copper foil tape engineered for solar applications, particularly in thin-film modules. It features a 1-oz dead soft copper foil backing with an electrically conductive acrylic adhesive that delivers stable performance across x, y, and z axes. The design ensures reliable solderability, compatibility with lamination processes, and consistent electrical conductivity, making it a dependable choice for solar panel charge collection and interconnection.

2. Applications

  • Charge collection in thin-film solar modules.

  • Electrical interconnection requiring stable conductivity.

  • Lamination processes in photovoltaic manufacturing.

  • Solderable joints in solar cell assembly.

3. Typical Properties

Property Value / Description
Adhesive Type Acrylic (conductive, pressure-sensitive)
Backing Material Tin-Plated Copper Foil (dead soft, 1 oz)
Backing Thickness 0.035 mm
Total Thickness 0.122 mm
Electrical Properties Conductive in x, y, z axes
Compatibility Supports lamination & soldering
Overall Dimensions 2 mm width × 1200 m length

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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