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3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6102, Black – High-impact, flexible epoxy for electronics with low and high temperature curing options

• Item Name: 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6102, Black
• Manufacturer: 3M
• Technologies: One-part epoxy, flexible and toughened
• Color: Black
• Cure Type: Low temperature (65 °C) or fast high temperature
• Package Size: 30 mL, 591 mL
• Shelf Life: Contact to Techniq VN for details

1. Product Overview

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6102 (Black) is a one-part epoxy adhesive with long room-temperature stability. It offers a low-temperature cure at 65 °C (149 °F) or a faster cure at higher temperatures. The adhesive is flexible and toughened, providing excellent chemical resistance, impact resistance, and high bonding performance.


2. Applications

  • Electronics industry (general bonding applications)

  • Suitable for indoor and outdoor use

  • Applications requiring high impact strength and chemical resistance

3. Typical Properties

Property Value
Adhesive Type One-Part Epoxy
Physical Form Liquid
Color Black
Bond Flexibility Flexible
Adhesion Strength 32,000 kPa
Shear Strength 4641 psi
Glass Transition Temperature (Tg) 45 °C (113 °F)
Viscosity (at room temp) 50,000 cps
Solids Content 100%
Specific Gravity / Density 1.28 g/mL
Cure Temperature 65 °C (149 °F)
Full Cure Time 20 min @ 65 °C (149 °F)
Room Temperature Stability Long pot life
Container Sizes 30 mL, 591 mL
Storage Temperature -20 °C (–4 °F)
Volume (Typical package) 1 fl oz (30 mL)
Industry Use Electronics
Brand 3M

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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