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3M™ VHB™ Tape Max-230GF – High-strength acrylic foam tape – transportation, construction, appliances, general industrial bonding

  • Item Name: 3M™ VHB™ Tape Max-230GF

  • Manufacturer: 3M

  • Technologies: Acrylic foam adhesive tape

  • Color: Gray

  • Cure Type: Pressure sensitive (self-adhesive, no curing required)

  • Package Size: 19 mm x 3 m roll, 2.3 mm thick, 58 rolls per case

  • Shelf Life: 24 months

1. Product Overview

3M™ VHB™ Tape Max-230GF is a high-performance, double-sided acrylic foam tape designed to replace mechanical fasteners, some forms of welding, and liquid adhesives. It offers exceptional bond strength, immediate handling strength for faster assembly, and design flexibility, making it suitable for demanding industrial and commercial applications.


2. Applications

  • Structural and semi-structural bonding (panels to frames, door kick plates, stiffeners, trim attachment)

  • Aluminum floor bonding, architectural panels, and vehicle signage frame attachment

  • Bonding composite materials, commercial vehicle panels, and appliance trim

  • Bonding glass panels to tablets/PCs and LCD display frame attachment

  • Vibration-resistant applications and overlap seam bonding

3. Highlights

  • Bond Strength: Up to 470 psi (3.24 MPa) in overlap shear

  • Immediate Handling: Allows faster assembly than liquid adhesives

  • Versatility: Adheres to metals and high-surface-energy substrates

  • Design Efficiency: Narrower bond lines reduce material usage

  • Recommended Use: Pair with 3M™ VHB™ Tape Max Promoter for optimal adhesion

  • Thickness Options: 0.6 mm, 1.1 mm, 1.6 mm, and 2.3 mm

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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