• Item Name: ABLESTIK ABP 8060T
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
ABLESTIK ABP 8060T is a silver, BMI hybrid die attach adhesive designed for high thermal and electrical conductivity. Heat-curable and hydrophobic, it is stable at elevated temperatures and provides excellent die shear strength. The material is suitable as a soft solder alternative for power device applications, ensuring efficient heat transfer and reliable performance in semiconductor packaging.
Die attach for integrated circuits and MOSFETs
Soft solder replacement in high thermal/electrical conductivity applications
High reliability electronic packages
Uncured Material
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | 6.0 |
| Viscosity, Brookfield CP51 @ 25°C (5 rpm), mPa·s (cP) | 12,000 |
| Filler Content | 85% |
| Work Life @ 25°C | 24 hours |
| Flash Point | See MSDS |
Cured Material
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion Alpha 1 | 55 ppm/°C |
| Coefficient of Thermal Expansion Alpha 2 | 120 ppm/°C |
| Tensile Modulus @ 25°C | 6,230 N/mm² |
| Tensile Modulus @ 250°C | 1,730 N/mm² |
| Thermal Conductivity | 20 W/(m-K) |
| Extractable Ionic Content (Cl⁻/Na⁺/K⁺) | <10 ppm each |
| Volume Resistivity | 2.5×10⁻⁵ ohm·cm |
| Die Shear Strength 1.27×1.27 mm Bare Si Die | 25°C: >2.3 Kg; 260°C: >1.3 Kg |
| Die Shear Strength 1.02×1.02 mm Ag Backmetal Die | 25°C: >2.0 Kg; 260°C: >1.3 Kg |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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